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Optotek's facility is specially designed for the manufacture of LED display subsystems. In-house capabilities include chip-on-board hybrid assembly and test. Assembly services are provided on a contract basis.
Hybrid & Surface Mount Assembly
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Ultrasonic wire bonding Thermocompression wire bonding Thick film printer Air-bearing diamond saws |
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Test & Quality Control
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Spectrometers Laser-induced photoluminescence Radiometer Computer-controlled electro-optical test equipment Thin film profilometers Precision scanning and measurement system |
Materials
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This section lists typical materials used in Optotek's assembly activities.
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